2017 Light Asia Exhibition depth report
1, CSP whirlwind
From 2013 onwards, CSP LED package to "no package" concept, to the LED packaging industry scraped a burst of strong cold.
Chip factory directly on the wafer in the fluorescent layer of the coating, cut directly after the LED lamp beads finished, eliminating the packaging plant solid crystal, wire, dispensing links, so that many crisis-conscious packaging plant feel Industry development may bring the ruthless consequences.
CSP if it is the mainstream form of packaging, the more powerful LED packaging plant, the more difficult to turn. Huge investment in solid crystal wire bonders, into scrap metal, painstakingly operating scale of operation, like Maqin Nuo line, instant collapse.
4, CSP advantages
CSP concept (chip scale package), from the IC package, refers to the chip area is greater than the package area of 80% of the package. Chip area of 80% of the package area, very little material waste; and wafer level CSP package (wafer level package) can be removed from the stent, simplifying the cost of material structure.
In addition to the great simplification of the packaging, CSP in the application there are unique advantages. First, the high power, 1212 size CSP, can be done with the EMC3030 the same 1.5W power. With this high power advantage, CSP is rapidly rolled out on mobile flash applications. Second, CSP minimal luminous area, is conducive to optical design. This has a great advantage in demanding applications for optical design, such as television backlighting. CSP application of the most radical business South Korea Samsung, about three years ago to give up the mature EMC 3030 straight down the backlight, sold the EMC support production line, turned to embrace CSP.
3, CSP dilemma
However, in the past three or four years, once the packaging plant tiger-like change of CSP, and did not replace the traditional stent-type package. Japan's old LED material company Nitto Denko, will produce CSP fluorescent silicone film technology, transferred to the Chinese company, it is a strategic CSP LED package back.
We can not help but ask, great subversion of the packaging industry CSP, why stop developing?
CSP itself is a big structural problem. First, the board is difficult. CSP is too small, the pad is very fine, requires high-precision SMD machines, the general terminal customers do not have such equipment, need new high-precision SMD equipment investment.
Second, the reliability of hidden dangers. CSP is not surrounded by dam structure, silica gel and chip, the combination of poor support, vulnerable to external and internal stress damage, resulting in the risk of layering or even shedding of the risk.
Again, the cost is high. CSP uses flip chip, flip chip prices, in 2013, is the same area of the installed LED chip twice, although the price has been declining, but by 2017 today, the price is still higher than the installed chip.
CSP although theoretically greatly simplifies the package structure, but limited by flip chip costs, can not be in general lighting with 2835, 3030 minutes. 2835,3030 as a general lighting market mainstream package form, with a large scale cost advantage, but also can not match the CSP.
4, CSP breakout
Mountain heavy water no doubt, LED car headlamps lighting rise, opened the CSP package a glimmer of hope.
Philips creatively applies CSP to automotive headlamps to replace traditional halogen lamps. Guangzhou, Jiangsu and Zhejiang and other places of the auto parts business, keenly smell the business opportunities, quickly follow the imitation.
CSP high-power minimalist package, it is necessary for car headlamps, vista, the creation of new application market, opened the door for the CSP. In addition to Lumileds, South Korean companies Seoul Semiconductor is also in this emerging market share a cup of soup. However, the cost of CSP, ease of use, reliability and other issues, and did not solve.
5, CSP promotion
Domestic packaging companies to follow up quickly, trying to solve CSP, cost, ease of use, reliability and other issues. In the just-concluded 2017 light Asia show we see some forward-looking LED packaging company, in all aspects of hard work, to promote the CSP in the automotive headlamps on the application.
Hongli Zhihui developed similar to the Philips 2016 products, the cost to do the ultimate. Hongli 2016 to Philips 2016 with the surge protection Zener tube to remove, simplifying the cost structure. According to the end customer news, you can do one-third of the price of Philips, BOM is almost close to the cost of flying on the ground. Hongli boldly to the lighting market logic, used in automotive lighting, like the year of the woods Sen. Hongli is likely to repel Lumileds, a leading position in the low-end car headlamp lighting market.
In the ease of use, with the substrate class CSP, for the placement of the convenience. Guangzhou Tim Xin introduced 1860 dusting process class CSP, three flip chip fixed on the ceramic substrate, greatly increasing the area of the bottom pad, you can easily carry out SMD, really for the customer to consider the use of the scene.
Reliability, the optical company's inorganic phosphor package 6018, using the pre-installed market, the high reliability of the packaging process. Inorganic phosphor package has a fluorescent layer does not fall off, the advantages of high temperature and humidity, Osram pre-installed package Ostar series is the use of this packaging process.
Inorganic phosphor package to overcome the Philips 2016 silicone package, Tim Xin 1860 powder packaging exists in the high temperature and humidity environment, silicone off, out of the shortcomings of leakage of blue light, it is a lot of rear lights after the headache problem. Guangchuang company's 6018 is said to cost more competitive than the Philips 2016, in order to map the high-reliability frontier technology, Pratt & Whitney in the post-installed market.
6, Summary
Four years waiting, CSP finally installed in the car after the market until the bloom. The new market is bound to the LED will put forward a new request, CSP still has a long road.
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